Green Six Layer HDI Multilayer PCB Printer Multi Circuit Boards 0.1mm

Specifications:

• Material: FR4 TG180

• Layer count: 6 layers

• Board thickness: 1.6mm

• Copper thickness: 1oz

• Minimum drill size: 0.1mm

• Minimum trace and gap: 0.1mm

• Surface finish: immersion gold

• Special technology: Blind via

• Applications: industry

PCB capabilities:

• Rigid PCB up to 30 layers

• Flexible PCB up to 6 layers

• Rigid flex PCB up to 20 layers

• Metal based PCB up to 8 layers

• Material used: FR4, high TG FR4, halogen-free FR4, high frequency, ceramic, aluminum or copper based, polyimide, PTFE hybrid

• Surface finish: HAL, lead-free HAL, immersion gold, silver, tin, OSP, hard gold plating, ENEPIG, carbon ink, blue mask

• DHI technology: 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3, stacked vias available

• Other special technology: conductively (or non-conductively) via filling, edge plating, back drill, heavy copper (up to 14oz), via in pad filling, extreme large or thick PCB, microwave and RF circuit boards

Competitive advantages:

• No minimum order quantity and free sample

• Focus on low to medium volume production

• Quick and on-time delivery

• International approvals

• Great customer service

• Diversified shipping method

• Wide range of PCB supplying

• One stop turnkey EMS service, including material procurement, SMT and thru-hole assembly, box build assembly

• UL recognized and RoHS Directive-compliant