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3Oz Copper Quick Turn Prototype PCB Assembly With 2U'' Immersion Gold 1.6MM

Global Success Circuits Co.,Ltd
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3Oz Copper Quick Turn Prototype PCB Assembly With 2U'' Immersion Gold 1.6MM

Brand Name : Global Success Circuits Co.,Ltd

Model Number : GPC12580

Certification : ISO 9001-2008, ISO TS 16949 ,UL

Place of Origin : China (mainland)

MOQ : 1 Piece

Price : US$ 0.3 - 1.3 / Piece

Payment Terms : L/C, D/P, T/T, Western Union

Delivery Time : 1 - 15 days

Packaging Details : vacuum package

Material : FR4

Board thickness : 1.6MM

Soldermask : Green

Silkscreen : White

Surface treatment : ENIG

Copper thickness : 3OZ

Min. grid line width : 4MIL

Minimum line width/space : 3MIL

Impedance control tolerance : +/-8%

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3Oz Copper Quick Turn Prototype PCB Assembly With 2U'' Immersion Gold 1.6MM


Number of layers: 6 layers
Material: fr4
Board thickness: 1.6mm
Surface plating: ENIG
Solder mask: Green
Special process description: NO


WHO IS GSC?
Global Success Circuits(www.szgpc.com) is pcb manufacturer with 3 facotries located in Shenzhen, Jiangxi, Jiangsu.

Quality
• State-of-the-art, ISO/TS and UL certified PCB manufacturers
• First Article-Certificate of Quality Compliance provided with each lot.
Products
• Rigid PCB’s
• Aluminum and copper core PCB’s
• Class 2 & 3

Item Mass production Small batch production
Number of layers UP TO 18L UP TO L
Laminate type FR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more. FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more.
Maximum board size 610mm*1100mm 610mm*1100mm
Board thickness 0.1mm-7.00mm <0.1mm and >7.00mm
Minimum line width/space 3.5mil(0.0875mm) 3mil(0.075mm)
Minimum line gap +/-15% +/-10%
Outer layer copper thickness 35um-175um 35um-210um
Inner layer copper thickness 12um-175um 12um-210um
Drilling hole size(Mechanical) 0.15mm-6.5mm 0.15mm-6.5mm
Finished hole size (Mechanical) 0.15mm-6.0mm 0.15mm-6.0mm
Board thickness hole size ratio 14:1 16:1
Board thickness tolerance(t=0.8mm) ±8% ±5%
Board thickness tolerance(t<0.8mm) ±10% ±8%
Min. grid line width 4mil(12, 18, 35um), 6mil(70um) 4mil(12, 18, 35um), 6mil(70um)
Min. grid spacing 6mil(12, 18, 35um), 8mil(70um) 6mil(12, 18, 35um), 8mil(70um)
Hole size tolerance(Mechanical) 0.05-0.075mm 0.05mm
Hole position tolerance(Mechanical) 0.005mm 0.005mm
Solder mask color Green, Blue, Black, White, Yellow, Red, Grey etc. Green, Blue, Black, White, Yellow, Red, Grey etc.
Impedance control tolerance +/-10% +/-8%
Min. distance between drilling to conductor(non-blind buried orifice) 8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L) 6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L)
Min. Character width and height(35um base copper) Line width: 5mil
Height: 27mil
Line width: 5mil; height: 27mil
Max. test voltage 500V 500V
Max. test current 200mA 200mA

Surface treatment
Flash Gold 0.025-0.075um 0.025-0.5um
Immersion Gold 0.05-0.1um 0.1-0.2um
Sn/Pb HASL 1-70um 1-70um
Lead-free HASL 1-70um 1-70um
Immersion Silver 0.08-0.3um 0.08-0.3um
OSP 0.2-0.4um 0.2-0.4um
Gold Finger 0.375um >=1.75um
Hard Gold Plating 0.375um >=1.75um
Immersion Sin 0.8um
V-Cut rest thickness tolerance ±0.1mm ±0.1mm

Outline profile
Chamfer The angle type of the chamfer 30,45,60
Plug via hole Max.size can be plugged 0.6mm
Largest NPTH hole size 6.5mm >6.5mm
Largest PTH hole size 6.5mm >6.5mm
Min. solder spacer ring 0.05mm 0.05mm
Min. solder bridge width 0.1mm 0.1mm
Drilling diameter 0.15mm-0.6mm 0.15mm-0.6mm
Min. pad diameter with hole 14mil( 0.15mm drilling) 12mil( 0.1mm laser)
Min. BGA pad diameter 10mil 8mil
Chemical ENIG gold thickness 0.025-0.1um(1-4U) 0.025-0.1um
Chemical ENIG nickel thickness 3-5um(120-200U) 3-5um
Min. resistance test Ω 5


3Oz Copper Quick Turn Prototype PCB Assembly With 2U'' Immersion Gold 1.6MM


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multilayer printed circuit board

      

multilayer pcb fabrication

      
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