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Customized Electronic PCB Assembly High TG175 3 OZ Copper Thickess RoHS ENIG PCB

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Customized Electronic PCB Assembly High TG175 3 OZ Copper Thickess RoHS ENIG PCB

Brand Name : Global Success Circuits Co.,Ltd

Model Number : GPC12580

Certification : ISO 9001-2008, ISO TS 16949 ,UL

Place of Origin : China (mainland)

MOQ : 1 Piece

Price : US$ 0.3 - 1.3 / Piece

Payment Terms : L/C, D/P, T/T, Western Union

Delivery Time : 1 - 15 days

Packaging Details : vacuum package

Material : FR4

Board thickness : 1.6MM

Soldermask : Green

Silkscreen : White

Surface treatment : ENIG

Copper thickness : 3OZ

Min. grid line width : 4MIL

Minimum line width/space : 3.5MIL

Impedance control tolerance : +/-8%

High TG : tg175

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Customized Electronic PCB Assembly High TG175 3 OZ Copper Thickess RoHS ENIG PCB

Number of layers: 2 layers
Material: FR4
Board thickness: 1.6mm
Surface plating: ENIG
Special process description: 3OZ

Solder mask: Green

Please call GSC if you need:


Fast turn-around prototypes.
Low-Medium-High volume production requirements.
To meet your prodution schedules.
On time delivery with a quality product.
A competitive price

PROTOTYPE AND VOLUME PRODUCTION:
Single sided
Double sided
Multilayer up to 8 layers
Immersion white tin process

For PCBA order, provide us:

  1. PCB Gerber file
  2. BOM list for PCBA
  3. Sample of PCB and PCBA
  4. Test method for PCBA

Services and applications:

  1. Through hole board assembly
  2. SMT assembly including BGA assembly, smallest placement: 0201
  3. Material procurement
  4. Consigned material management
  5. Plastic or metal enclosure
  6. Complex final assembly
  7. Functional test
  8. Cable assembly
  9. Labeling and packing
  10. Customized logistics per customer
  11. Laser cut framed SMT solder paste stencils
  12. PCB design and schematic capture

PCBA capabilities:

  1. Component height: 0.2-25mm
  2. Min packing: 0201
  3. Min distance from
  4. BGA: 0.25-2.0mm
  5. Min BGA size: 0.1-0.63mm
  6. Min QFP space: 0.35mm
  7. Min assembly size: 50*30mm
  8. Max assembly size: 350*550mm
  9. Pick-placement precision: 0.01mm
  10. Pick-placement range: QFP, SOP, PLCC, BGA
  11. Placement capability: 0805, 0603, 0402, 0201
  12. High-pin count press fit available
  13. SMT capacity per day: 3,200,000 point

Competitive advantages:

  1. No minimum order quantity and free sample
  2. Focus on low to medium volume production
  3. Quick and on-time delivery
  4. International approvals
  5. Great customer service
  6. Diversified shipping method

Materials Standard Advanced
FR4 (130‐180 Tg by DSC) Y Y
Halogen Free Y Y
BT Epoxy Y Y
Getek Y Y
Isola 370HR 406 408 IS410 IS 420 IS620 Y Y
Nelco 4000 Y Y
Rogers 4000 Y Y
PTFE Y Y
Dupont Pyralux N Y
Aluminum Core Y Y
Surface Finishes
ENIG Y Y
Flash Gold Y Y
Electrolytic Nickel/Hard Gold Y Y
HASL Y Y
Lead Free HASL Y Y
Immersion Ag Y Y
Standard Features Standard Advanced
Maximum layer count 20 36
Maximum Panel Size 21″x24″ 24″x30″
Outer Layer Trace/Spacing (1/3 oz) 0.0035″/0.0035″[90μm/90μm] 0.0025″/0.003″[64μm/76μm]
Inner Layer Trace/Spacing (H oz) 0.003″/0.003″ [76μm/76μm] 0.002″/0.0025″ [50μm/64μm]
Maximum PCB thickness 0.125″[3.2mm] 0.177″[4.5mm]
Minimum PCB thickness 0.008″[0.20mm] 0.004″[0.10mm]
Minimum mechancial drill size 0.008″[0.20mm] 0.004″[0.10mm]
Maximum PCB aspect ration 10:01 12:01
Maximum copper weight 5 oz [178μm] 6 oz [214μm]
Minimum copper weight 1/3 oz [12μm] 1/4 oz [9μm]
Minimum core thickness 0.002″[50μm] 0.0015″[38μm]
Minimum dielectric thickness 0.0025″[64μm] 0.0015″[38μm]
Minimum Pad Size over Drill 0.018″[0.46mm] 0.016″[0.4mm]
Solder Mask Registration +/‐ 0.002″[50μm] +/‐ 0.0015″[38μm]
Mimimum Solder Mask Dam 0.003″[76μm] 0.0025″[64μm]
Copper feature to PCB edge 0.015″[0.38mm] 0.010″[0.25mm]
Tolerance on overall dimensions +/‐ 0.004″[100μm] +/‐ 0.002″[50μm]
HDI Features
Immersion Tin Y Y

Customized Electronic PCB Assembly High TG175 3 OZ Copper Thickess RoHS ENIG PCB

Product Tags:

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4 layer pcb prototype

      
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