Immersion Gold Tg150 PCB Halegon Free FR4 PCB Green Or Red Solder Mask
specification for High TG halegon-free FR4 PCB with immersion gold in green or red solder mask
1. Base material: FR4
2. Copper Thickness: 1Oz
3. surface finishing: LF-HASL
4. board thickness: 1.6mm
PCB production ability for High TG halegon-free FR4 PCB with immersion gold in green or red solder mask
| Category | Description | Capability |
| Laminate Material | FR4, High TG FR4(tg150,tg170,tg180)
Halogen-free FR4, CEM1, CEM3,Polyimide,
Rogers ,Aluminum | We will order other special material accoprding to your request |
| Board Layers | Maximum layers | 1-18layers |
| Size | Maximum finished dimensions | 500*1200mm |
| Board Thickness | Minimum and Maximum | 0.2-3.2mm |
| Copper | Outer copper weight | 0.5oz (17um) - 4oz (140um) |
| Inner copper weight | 0.5oz (17um) - 4 oz (105um) |
| Drilling | Minimum drilling size | 0.15mm |
| Drill Deviation (True position size) | 2mil (0.050mm) |
| PTH hole tolerance | 3mil (0.075mm) |
| N-PTH hole tolerance | 2mil (0.050mm) |
| Minimum hole wall thickness | 20um |
| Angle of Countersink | 80°, 90°, 100°, 120° |
| Circuit line | Minimum width | 0.1mm/ 4mil |
| Minimum space | 0.1mm/ 4mil |
| Inner Layers | Minimum space from drilling to inner pattern | 6mil (0.15mm) |
| Minimum space from annular ring to inner pattern | 6mil (0.15mm) |
| Layer-to-layer registration | 3mil (0.08mm) |
| Board Profilling | Hole to board edge tolerance | ±4mil (0.1mm) |
| Pattern to board edge tolerance | ±4mil (0.1mm) |
| CNC Tolerance | ±4mil (0.1mm) |
| Minmum thickness after V-Cut | 12mil (0.3mm) |
| V-Cut tolerance | ±5mil (0.12mm) |
| V-Cut Angle | 20,30,45,60 |
| Solder mask | Color | green, light green, matte green, white black,matte black,yellow,red, blue |
| Thickness | ≥17um |
| Silkscreen | Color | White, black, yellow,
red, blue, green, gray |
| Minimum line height | ≥0.0625mm |
| Minimum line width | ≥0.125mm |
| Surface Finish | HASL, HASL pb free, immersion gold, immersion silver, O.S.P |
| Certification | IPC-A-600 Class II/III, UL E324220, ISO 9001,ISO/TS16949, ROHS |
Application for High TG halegon-free FR4 PCB with immersion gold in green or red solder mask:
health tech, medical, energy, lighting, defense, aerospace, industrial controls, consumer and transportation.
Lead time for High TG halegon-free FR4 PCB with immersion gold in green or red solder mask
| Production types | Layer No. | Lead Time |
| Samples | 1, 2 layers | 3-4 days |
| 4, 6 layers | 7-8 days |
| ≧ 8 Layer | 10-12 days |
| Mass Production | 1, 2 layers | 7-8 days |
| 4, 6 layers | 10-12 days |
| ≧ 8 Layer | 15 days |
| | 1, 2 layers | 2 days |
| | 4, 6 layers | 5 days |
| | ≧ 8 Layer | 7 days |
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Immersion Gold Tg150 PCB Halegon Free FR4 PCB Green Or Red Solder Mask Images
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