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Automotive Product TG 170 PCB FR4 Multi Layer Circuit Board With Blind / Bury Holes

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Automotive Product TG 170 PCB FR4 Multi Layer Circuit Board With Blind / Bury Holes

Brand Name : GSC

Model Number : GSC-001

Certification : UL, CE,Rohs

Place of Origin : Shenzhen China

MOQ : 1pcs No MOQ

Price : USD0.2-0.5/pc

Payment Terms : L/C, T/T, Western Union

Supply Ability : 150000 sq.m/month

Delivery Time : 5-15 working days

Packaging Details : vacuum bad + outer carton

material : FR4

Copper thickness : 1Oz-4Oz

surface finishing : LF-HASL

borad thickness : 1.6mm

min. hole size : 0.2mm

min. track width, spacing : 0.1*0.1mm

sold mask color : green or red

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Automotive Product TG 170 PCB FR4 Multi Layer Circuit Board With Blind / Bury Holes

1. Base material: FR4

2. Copper Thickness: 1Oz

3. surface finishing: LF-HASL

4. board thickness: 1.6mm

PCB production ability for High TG halegon-free FR4 multi-layer PCB with blind and bury holes for automotive product

Category	Description	Capability
Laminate Material	FR4, High TG FR4(tg150,tg170,tg180) Halogen-free FR4, CEM1, CEM3,Polyimide, Rogers ,Aluminum	We will order other special material accoprding to your request
Board Layers	Maximum layers	1-18layers
Size	Maximum finished dimensions	500*1200mm
Board Thickness	Minimum and Maximum	0.2-3.2mm
Copper	Outer copper weight	0.5oz (17um) - 4oz (140um)
Copper	Inner copper weight	0.5oz (17um) - 4 oz (105um)
Drilling	Minimum drilling size	0.15mm
	Drill Deviation (True position size)	2mil (0.050mm)
	PTH hole tolerance	3mil (0.075mm)
	N-PTH hole tolerance	2mil (0.050mm)
	Minimum hole wall thickness	20um
	Angle of Countersink	80°, 90°, 100°, 120°
Circuit line	Minimum width	0.1mm/ 4mil
Circuit line	Minimum space	0.1mm/ 4mil
Inner Layers	Minimum space from drilling to inner pattern	6mil (0.15mm)
	Minimum space from annular ring to inner pattern	6mil (0.15mm)
	Layer-to-layer registration	3mil (0.08mm)
Board Profilling	Hole to board edge tolerance	±4mil (0.1mm)
	Pattern to board edge tolerance	±4mil (0.1mm)
	CNC Tolerance	±4mil (0.1mm)
	Minmum thickness after V-Cut	12mil (0.3mm)
	V-Cut tolerance	±5mil (0.12mm)
	V-Cut Angle	20,30,45,60
Solder mask	Color	green, light green, matte green, white black,matte black,yellow,red, blue
Solder mask	Thickness	≥17um
Silkscreen	Color	White, black, yellow, red, blue, green, gray
	Minimum line height	≥0.0625mm
	Minimum line width	≥0.125mm
Surface Finish	HASL, HASL pb free, immersion gold, immersion silver, O.S.P
Certification	IPC-A-600 Class II/III, UL E324220, ISO 9001,ISO/TS16949, ROH
Certification

Lead time for High TG halegon-free FR4 multi-layer PCB with blind and bury holes for automotive product

Production types	Layer No.	Lead Time
Samples	1, 2 layers	3-4 days
	4, 6 layers	7-8 days
	≧ 8 Layer	10-12 days
Mass Production	1, 2 layers	7-8 days
	4, 6 layers	10-12 days
	≧ 8 Layer	15 days
	1, 2 layers	2 days
	4, 6 layers	5 days
	≧ 8 Layer	7 days

Factory over-view for High TG halegon-free FR4 multi-layer PCB with blind and bury holes for automotive product

Product Tags:

fr4 printed circuit board

fr4 pcb

Automotive Product TG 170 PCB FR4 Multi Layer Circuit Board With Blind / Bury Holes Images

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