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4 Layer High TG Heavy Copper PCB Board 3 Oz Copper Thickness Immersion Gold

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4 Layer High TG Heavy Copper PCB Board 3 Oz Copper Thickness Immersion Gold

Name: 4 Layer High TG Heavy Copper PCB Board 3 Oz Copper Thickness Immersion Gold
Brand: Global Success Circuits Co.,Ltd
Price: 1 USD

Brand Name : Global Success Circuits Co.,Ltd

Model Number : GSC

Certification : UL , ISO . TS16949 , ROHS

Place of Origin : China

MOQ : 1pcs

Payment Terms : D/A, D/P, T/T, Western Union

material : FR4

layers : 4

copper : 3oz

Min. Line Width : 0.1mm

Min. Hole Size: 0.3mm : 0.3mm

surface finish : immersion gold

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4 Layer High TG Heavy Copper PCB Board 3 Oz Copper Thickness Immersion Gold

applications:

Weapons Control Systems
Power Supplies for Radar Systems
Primary and Secondary Windings of High Power Planar Transformers
Power Distribution Panels
Battery Charger and Monitoring Systems

Power electronics products using heavy copper circuitry have been in use for many years in the military and aerospace industry and are gaining momentum as a technology of choice in industrial applications. It's believed that market requirements will extend the application of this type of product in the near future.

Category	Description	Capability
Laminate Material	FR4, High TG FR4(tg150,tg170,tg180) Halogen-free FR4, CEM1, CEM3,Polyimide, Rogers ,Aluminum	We will order other special material accoprding to your request
Board Layers	Maximum layers	1-18layers
Size	Maximum finished dimensions	500*1200mm
Board Thickness	Minimum and Maximum	0.2-3.2mm
Copper	Outer copper weight	0.5oz (17um) - 4oz (140um)
Copper	Inner copper weight	0.5oz (17um) - 4 oz (105um)
Drilling	Minimum drilling size	0.15mm
	Drill Deviation (True position size)	2mil (0.050mm)
	PTH hole tolerance	3mil (0.075mm)
	N-PTH hole tolerance	2mil (0.050mm)
	Minimum hole wall thickness	20um
	Angle of Countersink	80°, 90°, 100°, 120°
Circuit line	Minimum width	0.1mm/ 4mil
Circuit line	Minimum space	0.1mm/ 4mil
Inner Layers	Minimum space from drilling to inner pattern	6mil (0.15mm)
	Minimum space from annular ring to inner pattern	6mil (0.15mm)
	Layer-to-layer registration	3mil (0.08mm)
Board Profilling	Hole to board edge tolerance	±4mil (0.1mm)
	Pattern to board edge tolerance	±4mil (0.1mm)
	CNC Tolerance	±4mil (0.1mm)
	Minmum thickness after V-Cut	12mil (0.3mm)
	V-Cut tolerance	±5mil (0.12mm)
	V-Cut Angle	20,30,45,60
Solder mask	Color	green, light green, matte green, white black,matte black,yellow,red, blue
Solder mask	Thickness	≥17um
Silkscreen	Color	White, black, yellow, red, blue, green, gray
	Minimum line height	≥0.0625mm
	Minimum line width	≥0.125mm
Surface Finish	HASL, HASL pb free, immersion gold, immersion silver, O.S.P
Certification	IPC-A-600 Class II/III, UL E324220, ISO 9001,ISO/TS16949, ROHS

The construction of a heavy copper circuit endows a board with benefits such as:

Increased endurance to thermal strains.
Increased current carrying capacity.
Increased mechanical strength at connector sites and in PTH holes.
Use of exotic materials to their full potential (i.e., high temperature) without circuit failure.
Reduced product size by incorporating multiple copper weights on the same layer of circuitry (see Figure 1).
Heavy copper plated vias carry higher current through the board and help to transfer heat to an external heatsink.
On-board heatsinks directly plated onto the board surface using up to 120-oz copper planes.
On-board high-power-density planar transformers

Product Tags:

copper clad printed circuit board

copper based pcb

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